Destructive Physical Analysis (DPA)
Rigorous Quality Evaluations!
At Analytical Solutions Destructive Physical Analysis (DPA) is performed to evaluate
the quality of construction of electronic devices, normally performed per lot date
code in order to verify that the quality meets the specified requirements.
Our broad background in device construction techniques and device failure mechanisms
provides us with the extra insight required to make good technical judgments on
the use of a lot of devices. This extends into the Plastic Encapsulated Microelectronic
(PEM) DPA's where good jet etch decapsulation techniques are required to prevent
damaging the part.
Destructive Physical Analysis (DPA) This rigorous process of sample testing is done
to specification ensuring a high reliability component or device is fabricated to
the required standards. Key steps in this process include External visual inspection,
X-radiography, Delidding, Internal and SEM inspection, Energy Dispersive X-Ray Analysis
(EDS), bond pull and die shear testing.